Professional electronic component inspection capabilities

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KC Lab customizes comprehensive testing solutions to verify the authenticity and ensure the quality of the products.

Visual Inspection
Visual Inspection
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KC Master’s quality engineers rely on their extensive knowledge and experience to ensure that component dimensions, markings, leads, packaging, and other characteristics of closely monitored components must be consistent with manufacturer specifications.

Non-destructive Inspection
Non-destructive Inspection
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Non-destructive testing is a series of inspections and quality tests performed to detect internal and external defects, voids and other anomalies of components without affecting component functionality or reliability.

Destructive Inspection
Destructive Inspection
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Destructive testing is the last process of KC Lab’s authenticity testing. In certain cases, more invasive detection methods, such as unpacking and solderability testing, may help us to confirm the product effectiveness.

Visual Inspection
Visual Inspection

used in maintenance of facilities, using either or all of raw human senses such as vision.

Dimension Inspection
Dimension Inspection

uses quantifiable values to measure virtually any physical characteristics such as: Length, width, and height.

XRF Analysis
XRF Analysis

uses the wavelength and intensity of atomic fluorescence lines to quantitatively analyze hazardous substances restricted by RoHS.

X-Ray Inspection
X-Ray Inspection

measure critical process parameters like: thickness, composition, roughness, density, porosity, and crystal structure and crystal structure defects.

Functionality Test
Functionality Test

includes basic parameter testing of wire resistance, insulation resistance, correct value of dielectric loss angle, capacitance, etc.

LCR Test
LCR Test

measure the inductance (L), capacitance (C), and resistance (R) of an electronic component.

Chemical Decapsulation
Chemical Decapsulation

the process of breaking in to semiconductor devices to discover what defects might lie within.

Reliability Analysis
Reliability Analysis

tests the ability of a system or component to function under stated conditions for a specified period of time.

Solderability Analysis
Solderability Analysis

determine if a component provides the degree of wetting necessary for a solid solder connection.